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Navigating Permanent Roaming for IoT: Challenges and Solutions

The growing IoT ecosystem has brought forth its own set of challenges. One such challenge is permanent roaming.
While many countries allow permanent roaming without significant constraints, some big countries have implemented limitations on this practice.
There are multiple ways to circumvent the problem of permanent roaming. These includeeSIM, Multi-IMSI, aggregator platforms, and dynamic network selection algorithms.

The Internet of Things (IoT) has revolutionized the way we interact with the world around us. From smart homes to industrial automation,IoTdevices are playing a pivotal role in enhancing efficiency and convenience. However, the growing IoT ecosystem has brought forth its own set of challenges. One such challenge is permanent roaming, a phenomenon that has gained significance due to the global nature ofIoTdeployments. In this blog, we will delve into the concept of permanent roaming for IoT, discuss the challenges it poses, and explore potential solutions.

Understanding permanent roaming for IoT

Permanent roaming in the context of IoT refers to the practice of utilizingcellularconnectivity across different geographical locations on a consistent basis. Unlike traditional mobile phones, which might roam temporarily when users travel, IoT devices often need to maintain connectivity across various regions for extended periods. This is a fundamental requirement for IoT devices used in logistics, remote monitoring,agricultureand other activities.

While many countries allow permanent roaming without significant constraints, some big countries have implemented limitations on this practice. The map below shows countries where permanent roaming is banned and those where local carriers have imposed restrictions.

Countries that prohibit permanent roaming includeIndia, China, Brazil, Saudi Arabia, Egypt, Nigeria, Turkiye (formerly Turkey), UAE and Singapore. Besides, mobile operators in the US, Canada and Australia have imposed restrictions on permanent roaming within theirnetworks, effectively imposing a ban on this practice in these countries. Remarkably, these 12 countries collectively cover more than 50% of the world’s population and account for well over three-quarters of the IoT market.

Challenges posed byrestrictions onpermanent roaming

IoT devices are typically deployed on a global scale, leading to a complex scenario where these devices are connected to multiple mobile network operators (MNOs) across different countries. Imagine an electric car company that markets its vehicles across various regions. In countries where permanent roaming is not allowed, the company must procure local connectivity. This situation presents a host of challenges that ripple through the operational landscape:

Complex network management:Handling connections to multiple networks becomes really complex. Each network might have different prices, coverage areas and technical needs. The process of harmonizing such distinct facets is likely to be intricate and time-consuming.
Dealing with many partners:该公司需要使用不同的网络artners. This means making deals, managing money and ensuring good service quality across networks. Besides, multiple networks means multiple bills and contracts. All of these tasks together can become very complicated and hard to manage as this activity is not core to the business.
Higher costs:Because of the rules against permanent roaming, the company has to pay more money to set up connections in each country. This extra cost can make things difficult and might affect how much the company can grow.
Less flexibility:Without the ability to use permanent roaming, the devices might not work as well when they move between countries. This can be a problem for customers who expect a consistent experience.
More planning needed:Since the company can’t rely on the same connection everywhere, it needs to plan ahead. This can slow things down and make expansion harder. There could be issues related to data sovereignty and compliance that may require additional planning.

Solutionsforpermanent roaming

There are multiple ways to circumvent the problems associated with permanent roaming. However, it is critical to select a managed service provider that has tie-ups with local MNOs/MVNOs. Alternatively, direct MNO relationships can be managed using aggregator connectivity management platforms.

eSIM (embedded SIM):eSIMtechnology is a game changer in the IoT landscape. It enables devices to have programmable SIM cards that can be remotely provisioned over the air. With eSIM, IoT devices can switch between different MNOs without requiring a physical SIM card replacement, thus simplifying the management of connectivity. UsingeSIM, it is possible to switch between a local profile and multiple roaming profiles every 90 days to avoid permanent roaming. Many managed service providers have this workaround to avoid permanent roaming. The new IoT eSIM specifications will further simplify the provisioning and orchestration of connectivity.

Multi-IMSI (International Mobile Subscriber Identity):Multi-IMSI solutions allow a single physical SIM card to have multiple IMSIs from different MNOs. This enables the device to seamlessly switch between networks while maintaining a single SIM card. By intelligently selecting the optimal IMSI based on factors like network quality and cost, Multi-IMSI solutions optimize connectivity and reduce operational complexities. However, the managed service provider needs to have a local presence or tie-ups.

Aggregator platforms:Aggregator connectivity management platforms (CMPs) act as intermediaries between IoT device owners and various MNOs. These platforms offer a unified interface for managing connectivity, provisioning,billing, and reporting across multiple networks. By consolidating these tasks, aggregator platforms simplify the management of permanent roaming for IoT devices. A new set of aggregator CMPs like IOTM and ConnectedYou is targeting enterprises instead of carriers to solve the problem of managing multiple networks.

Some of the aggregator platforms offer Dynamic Network Selection Algorithms. Smart algorithms can be implemented in IoT devices to dynamically select the most suitable network based on parameters such as signal strength, latency and cost.

Conclusion

With the IoT landscape continuing to expand globally, the challenges associated with permanent roaming are becoming more pronounced. However, with the advent of innovative solutions such aseSIM、Multi-IMSI聚合平台,和动态twork selection algorithms, these challenges can be effectively mitigated. These solutions not only simplify the management of connectivity but also enhance cost-effectiveness and operational efficiency for IoT deployments. The key is to find the right managed services partner, which has a platform that enables easy management of connectivity.

AI Chip Market: Advanced Packaging Capabilities Key Differentiating Factor

The requirement of computing power, latency and higher bandwidth can be met with the combination of advanced packaging and wafer fabrication techniques.
One of the integration techniques widely used is CoWoS (chip-on-wafer-on-substrate), a 2.5D IC integration technology that integrates logic computing and HBM chips.
As AI becomes more pervasive across devices and industries, vertical players such as Apple, Tesla, Google and Meta are adding tons of AI capability in their offerings and would also demand integrated AI compute for their portfolios. CoWoS seems the best bet for now.

先进的包装提供了一个良好的杠杆作用增强overall chip performance beyond traditional geometric scaling on transistors, and extend Moore’s Law over the next decade. Advanced packaging is categorized as front-end 3D which stacks chips or wafers vertically and backend 2.5D CoWoS that interconnects dies horizontally via RDL (redistribution layer) or interposer.

HBM going mainstream with demand for AI applications

The requirement of computing power, latency and higher bandwidth can be met with the combination of advanced packaging and wafer fabrication techniques, especially for high-performance computing chips.AIaccelerators used to train AI models in data centers require the highest memory bandwidth available. Unlike earlier systems, which were memory-constrained, current data center architectures use a variety of techniques to overcome memory bottlenecks. One of the solutions widely implemented to boost bandwidth and memory capacity is high bandwidth memory (HBM). AI has been a big driver of HBM inGPUseven though traditionally it has been a niche technique.

HBM technology works by vertically stacking DRAM chips on top of one another and interconnected through TSVs (Through Silicon Vias) and micro-bumps. For AI training and high-performance applications, HBM can deliver terabytes per second which is significant processing power required for AI and high-performance computing applications as the DRAMs are stacked. While HBM offers extreme bandwidth for the off-chip memory needed for data center AI accelerators, tradeoffs include HBM’s cost and thermal limitations. HBM is becoming more mainstream, with advances in the area, performance improvement and reduced power consumption with every iteration, as the DRAM stack and theSoCare placed in a single package substrate, driving its adoption in AI applications.

CoWoS major driver for packaging advanced logic with HBMs

One of the integration techniques widely used is CoWoS (chip-on-wafer-on-substrate), a 2.5D IC integration technology that integrates logic computing and HBM chips by mounting them on a silicon interposer and then placing them directly on a packagesubstrate. TSV/RDL interposers are for extremely fine-pitch, high-I/O, high-performance and high-density semiconductor IC applications.

The logic and HBMs are first bonded side by side on the silicon interposer to form chip-on-wafer(CoW) with fine pitch and high-density interconnect routing among the devices. Each HBM consists of DRAMs with micro-bumps and a logic base with TSVs straight through them. Through-Silicon Via (TSV) is the feature that enables 2.5D and 3D advanced packaging. TSVs are electrical connection pathways that are short vertical columns running through the silicon wafer or die and enable smaller package sizes and denser interconnects, improve electrical performance by shortening the electrical distance traveled, and enable stacking of multiple chips used in products like HBM. Finally, the TSV interposer’s assembly with larger bumps on a package substrate is done.

Source: Counterpoint Research

CoWoS also a bottleneck for industry

Over the years, CoWoS technology development has focused on supporting increasingsiliconinterposer dimensions to support processors and HBM stacks in the overall package. Today, CoW with C2 bump by TCB method is the most used assembly method for silicon-to-silicon flip chip bonding. CoW flip chip by a bumpless technique called the hybrid bonding method, currently in R&D, will gain traction over the years.

CoWoS has been the main bottleneck for AI shipments recently. Increasing CoWoS capacity to fulfill the rising demand, driven byNVIDIA,AMD,BroadcomandAmazon, has been the focus.

Addressing challenges to CoWoS growth

To address these challenges, existing players need to diversify the supply chain by increasing capacity and collaboration with players in the value chain – OSATs, interposer manufacturers, and packaging equipment vendors.

What should pure-play foundries do?

TSMC has capacity constraints with respect to CoWoS creating some bottlenecks for NVIDIA and other customers. One of the reasons here is the bottleneck from equipment suppliers and manufacturing interposers. Therefore,TSMC应该和潜在合作outsour吗ce to its partners, which will help stabilize volume in the near- to mid-term and meet the growing demand for advanced packaging in AI and HPC applications. So, long term, TSMC should collaboratively work with equipment manufacturers to optimize the CoWoS processing techniques such as TCB (Thermal Compression Bonding) and hybrid bonding.

该设备vendors do?

Equipment players should collaborate closely with foundries and co-develop optimized processes to scale the CoWoS packaging. For example,AppliedMaterials is actively developing new technologies for hybrid bonding and TSV to advance heterogeneous chip integration that help chipmakers integrate chiplets into advanced 2.5D and 3D packages. Similar collaborations would be expected from other players such as KLA Tencor, Lam Research, ASMPT and BESI to drive advancements in CoWoS packaging or other competing techniques such as hybrid bonding techniques to enable improvements in fine pitch, I/O density and power consumption. Research collaborations will provide semiconductor and systems companies with a complete suite of tools and technologies for developing and prototyping various packaging designs and enable continued advances in power, performance, area, cost and time-to-market.

What should IDMs do?

Samsung and other IDMs are also actively looking to take a share of the advanced packaging market and enhance their design and manufacturing capabilities to establish a sufficient customer base for high-end solutions. For example, Samsung Electronics’ HBM-PIM technology integrates processing chips and advanced memory chips like HBM with its proprietary 2.5D or 3D packaging technology. Samsung has developed HBM-PIM as a potential replacement for its existing HBM2 product where the bottom four of eight memory chips are replaced with chips containing both DRAM and compute cores. By doing some of the compute in the DRAM, the volume of data that needs to go to the processor decreases, effectively speeding up the neural network and saving the power needed to transport data. As this technology develops, Samsung will be able to leverage its advanced packaging solutions and technology as it is the only company that has a chip business portfolio spanning memory chips to contract-based processing chip fabrication and packaging and will be able to increase its market share and compete with TSMC.

Advanced packaging is also an opportunity for IDMs that have mature node capability to enhance the performance of their existing product portfolios and capture significant market share.

What should OSATs do?

OSATs like ASE and Amkor are actively investing to expand advanced packaging offerings but it will take time to benefit from the uptrend. Yield and volume output are the keys for foundries to grow their advanced packaging platform. This also poses a barrier for most traditional OSAT companies to enter this area. However, they could collaborate with leading players and increase their capacity in back-end processes. Another option could be to increase investment in R&D for advanced packaging applications in mature nodes, which will help prepare for the next upturn, like moving away from flip chip and wire bonding.

OSATs will face rough weather if they don’t join the wave of advanced packaging to achieve PPA benefits in mature nodes. But they can get a first-mover advantage if they start investing now, especially inAIapplications in theIoT,automotiveand network segments.

What should fabless vendors do?

NVIDIA accounts for the majority of the current CoWoS capacity. Getting the high performance required for AI workloads is possible because of the benefits being derived from CoWoS packaging. The technology offers flexibility in terms of a wide range of interposer sizes, package sizes and a number of HBM cubes, and provides the best performance with the highest integration density required for high-performance computing applications.

As AI becomes more pervasive across devices and industries, vertical players such as Apple, Tesla, Google and Meta are adding tons of AI capability in their offerings and would also demand integrated AI compute for their portfolios. CoWoS seems the best bet for now. As other competitors including Intel expand their offerings to capture the AI demand, they would have to match the best in class, which as of now is provided through CoWoS.

From the client compute perspective, as the industry develops scaled-down AI models capable of running on smartphones and users demand AI models on smartphones, it might experiment with CoWoS. However, implementing CoWoS packaging in smartphone applications at present will not be cost-effective and alternative packaging techniques will be a better option to consider.

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Colombia Telecom Meet Focuses on Digital Divide, 5G Launch

Colombian telecom operators and government are positive about the outcome of the 5G spectrum auction in December.
The government, telecom operators and regulatory bodies want to increase broadband penetration and provide training to Colombians to bridge the digital divide.
Telecom operators ETB and Claro shared their plans to leverage 5G to enhance verticals like education, mobility, and B2B services.

Even asColombialooks forward to holding its first 5G auction in December this year, it has much more basic and long-pending telecom sector-related issues that need the attention of all stakeholders, whether the operators or government departments. It is with this in mind that representatives from the Colombian government, regulatory bodies, telecom operators and manufacturers gathered in the nation’s capital, Bogota, at the end of June for the Conecta Colombia summit. The event, which is a part of the series that Conecta Latam organizes in the region, saw discussions on regulation, technology and, of course, business. A team of analysts from Counterpoint was also present at the event. Here are their key takeaways:

5G and connectivity expansionThe potential of 5G technology and its impact on various sectors were essential discussion topics at the event. Telecom operators ETB and Claro shared their plans to leverage 5G to enhance verticals like education, mobility, and B2B services. Investments in broadband and 4G were also emphasized as ongoing priorities alongside the imminent 5G auction. The discussions also recognized the need to focus on network coverage and connectivity expansion, ensuring that before the widespread adoption of 5G.

Main 5G verticals to be developed in Colombia, including a $166 billion opportunity until 2035 as per Hugo Chang at Nokia.

Security and digital transformation

Bridging the digital divideAccording to the regulators, by the end of Q1 2023, Colombia had 9 million fixed broadband connections, which means that only approx. 61% of households in Colombia have access to fixed broadband. Highlighting Colombia’s digital divide, speakers at the summit emphasized the need to address challenges Colombians have such as lack of technical skills and connectivity. The government, telecom operators and regulatory bodies discussed strategies to increase broadband penetration, provide training to Colombians, involve regional stakeholders in the sector decision-making, and improve job formalization. The focus was on leveraging technology to narrow the digital divide and ensure equal access to digital opportunities.

“Centros Digitales” at the core of the solution to bridge the digital divide. MinTic aims to reach 85% broadband penetration by 2031 compared to 61% in Q1 2023.

Main 5G verticals to be developed in Colombia, including a $166 billion opportunity until 2035 as per Hugo Chang at Nokia.

Security and digital transformation

During 2022 there were 20 billion failed cyberattacks in Colombia as disclosed by a Fortinet study, based on that government officials and telecom operators highlighted the importance of cybersecurity for the industry. Panel discussions emphasized the need for a national entity to coordinate carrier efforts and use artificial intelligence (AI) as a defensive tool. Besides, the event explored the concept of digital transformation withintelecomcompanies, with discussions revolving around employee training, customer experience and the transformation of big data into “mega data” facilitated by 5G. The role of alternative revenue drivers such as VoLTE and MVNO products were also highlighted as options before the 5G benefits come to play.

Saul Kattan, technical consultant of the Colombian presidency leads the panel discussion on the role of a national cybersecurity entity sponsored by the government.

What is next?监管机构将公布8月1日draft of the auction process, covering the mechanism to be followed and the required technical conditions for the applicants. The second draft will be released one month later and the final in October. In November and December, all the interested parties will submit their applications for the auction, which will start on December 20. 2024 can become the year of the 5G availability in the country.

5G auction and 4G spectrum renovations chronogram.

“Centros Digitales” at the core of the solution to bridge the digital divide. MinTic aims to reach 85% broadband penetration by 2031 compared to 61% in Q1 2023.

Main 5G verticals to be developed in Colombia, including a $166 billion opportunity until 2035 as per Hugo Chang at Nokia.

Security and digital transformation

Saul Kattan, technical consultant of the Colombian presidency leads the panel discussion on the role of a national cybersecurity entity sponsored by the government.

5G auction and 4G spectrum renovations chronogram.

CBRS Opens-Up 3.5 MHz Mid-Band Spectrum to New Users

Last week, we saw the formal start of Initial Commercial Deployment (ICD) of the 3.5 MHz Citizens Broadband Radio Services (CBRS) spectrum band in the US. The CBRS band is a 150 MHz slice of spectrum available for use on a shared and unlicensed basis. The spectrum is divided into three tiers – Tier 1, which is used by incumbents such as the Navy, Department of Defense and by military satellites, and two lower tiers, which are allocated for commercial use (Exhibit 1).

申请者可以申请二级优先访问License (PAL), a renewable 10-year license to use one or more 10MHz channels within the 3,500-3,650MHz portion of the band, in a limited geographical area. They can also apply for Tier-3 General Authorised Access (GAA), which is unlicensed, like Wi-Fi, and provides a dynamic allocation of the available 100MHz channels so that access does not interfere with communications in the two upper tiers.

认证和完整的商业服务经验ected to start in Q4 2019 after the 30-day ICD period is successfully concluded. To date, only GAA licenses have been issued, and the auctioning of PAL licenses is not expected until mid-2020. Further, 5G shared spectrum services are also scheduled to begin in 2020 following the publication of the CBRS Alliance’s Release 3 specifications in Q4 2019.

Picture Credit: Lanner

Exhibit 1: The CBRS 3-tier Spectrum Sharing Architecture

The major attraction of the CBRS band is that it will allow a wide range of companies – from cable companies, wireless and fixed telecom operators to a host of commercial and industrial companies – to develop, build and operate their own wireless networks without the involvement of the “Big 4” mobile operators. For example, the CBRS band can support business models for indoor, small cell deployments funded and owned by enterprises themselves. Meanwhile, GAA licenses are especially well-suited for private networks as they combine the best of both LTE and Wi-Fi networks, i.e. they offer traffic management, security, reliability plus low latency.

Companies eyeing opportunities in this band include Amazon, Google, Motorola, and Nokia as well as many industrial enterprises looking to use the spectrum to build LTE and later 5G private networks for IoT, IIoT (Industrial IoT) and other applications.

Amazon has tested a private IoT network designed to support devices such as real-time surveillance cameras and smart meters, with several partners. Federated Wireless, cable company Charter Communications, and Landmark Dividend want to build private LTE networks while Motorola wants to use the band for its MotoTrbo service. Other companies involved include Google, Facebook, Nokia, and Microsoft, as well as Walt Disney Parks and Resorts.

The ‘Big 4’ MNOs are also heavily engaged as the band will enable them to increase capacity by combining transmission in the CBRS band with other licensed spectrum bands via carrier aggregation technology. They could also use CBRS to boost their network performance by using it as a kind of interim low latency alternative or complement to Wi-Fi prior to the widespread deployment of 5G. In-building CBRS networks will also likely be connected to the operators’ public 5G networks for seamless interoperability.

Verizon is particularly keen on the band. Although it owns significant amounts of mmWave spectrum, it lacks sufficient mid-band spectrum and has been testing both commercial and private mobile networks for several months, particularly the use of indoor/outdoor small cells. The company is already offering CBRS-capable devices to its customers, including the latest Apple iPhone 11 handsets, Samsung Galaxy S10 and Google Pixel 3. Meanwhile, AT&T is keen to use the band for fixed wireless Internet services to rural customers and expects to start services in late Q4 2019.

Although there is tremendous interest in using the band, ultimately, its success will depend on a number of factors. Top of the list, however, will be the ability of the spectrum sharing system (administered by Federated Wireless, CommScope, Google, and Nokia) to protect the access of Tier 1 incumbent users. Although multiple trials have taken place, it will take some time to determine whether spectrum sharing works as envisaged. If it does not, then this is potentially a major issue, as most of the Tier 1 users are located along the US coastline, where the majority of the population live and where the demand for CBRS spectrum is likely to be highest.

Pioneered by the Federal Communications Commission (FCC) and commercial US wireless companies, the CBRS dynamic spectrum sharing model is being closely watched by regulators around the world. If successful, it will likely be implemented outside the US. Together with other similar systems under development elsewhere (such as ETSI’s Licensed Shared Access), spectrum sharing could potentially open up swathes of lightly used spectrum bands around the world for new applications. Counterpoint Research believes that this will dramatically change the wireless landscape, for example, by accelerating the deployment of wireless networks by non-MNO companies. In future, dynamic spectrum sharing is likely to become the norm rather than the exception in underutilized and unlicensed spectrum bands, but is unlikely to be used in mobile licensed bands.

Achieving Sustainable Internet Access for the Next Billion

Overview:

While 5G, IoT and other technological advancements are rapidly entering the market in many nations, there are still over three billion people who are not connected to the internet. A majority of those without access are in developing regions where concomitant factors of poor national governance, a dearth of relevant infrastructure, and lack of inward investment, serve to limit the populations’ access to basic connectivity.

This report aims to identify the underlying drivers of lack of internet access and to highlight which companies are making progress in closing the digital divide. Can access be provided profitably and, if so, how can it be achieved in a sustainable manner?

Table of Contents:

Introduction
Availability – Covering the coverage gaps
Affordability – the device, the service and everything else
Case Study
Conclusion & Outlook

Number of Pages: 21
Author: Peter Richardson and Varun Mishra

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To view more reports from Counterpoint, clickhere.

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Navigating Permanent Roaming for IoT: Challenges and Solutions

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AI Chip Market: Advanced Packaging Capabilities Key Differentiating Factor

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