- Arm globally unveiled its Total Compute Solutions 2023 (TCS23) platform at the Computex 2023 expo in Taipei.
- TCS23 will power the next-generation secure, intelligent (AI) and immersive (3D visual) experiences.
- Arm continues to innovate across the stack to power visual computing applications designed for 3nm nodes and supported by advanced software and toolsets.
- The next two years are going to be super-crucial for Arm as it pivots to a newer licensing model.
Leading mobile computing SoC architecture companyArmglobally unveiled its Total Compute Solutions 2023 (TCS23) platform at the Computex 2023 expo, being held in Taipei from May 30 to June 2. The latest generation of TCS will power the next-generation secure, intelligent (AI) and immersive (3D visual) experiences.
Arm commenced the TCS journey in 2021 with a focus on three key aspects of SoC design –ComputePerformance,SecurityandSoftware(DeveloperAccess). This complete package helps an SoC designer to integrate Arm IP offerings across CPU, GPU and System IP (Interconnect, SLCs, MMUs) to reduce complexity, costs and time to market.
TCS23 brings optimized physical IP, new GPU and advanced software tools
Arm continues to innovate across the stack, from its Physical/Pop IP, CoreLink System IP, ARMv9 architecture CPU cluster (Cortex-X4, -A720 and -A520) to new architecture-driven 5thGen GPU (Immortalis-G720), to power visual computing applications designed for 3nm nodes and supported by advanced software and toolsets.
Source: Arm
CPU advancements
- TheARM v9.2 Cortexcluster aims to deliver adouble-digit performance boostwithCortex-X4(+15%) atlesspower(40% lower) compared to the previous generation on the same process node.
- Many of the futurepremium Androidsolutions will be powered by theadvanced 3nmprocess node in the coming years, which will further benefit from the TCS23 and beyond cluster advancements.
- According to Counterpoint’s foundry tracker, almosta third of the foundry smartphone AP/SoC wafer revenuesin 2024 will come from the3nm processnode
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Arm also announced thetapingout of the upcomingCortex-X4on theTSMCN3Eprocess, an industry first.
- The newDynamicIQ Shared Unt (DSU-120)overall drives the demandingmulti-threadedperformance scaling across multiple computing devices, from smartphones and wearables to STBs to PCs, and for all premium, performance and efficiency use cases.
- Further, TCS23 is also designed to accelerate machine learning (ML) and AI workload performance ranging from 12%+ depending on the CPU core type.
System IP and GPU advancements
- The new innovations across the CoreLink CI-700 help reduce the silicon areas with a significantreduction in system interconnect latency.
- Arm is also promising optimizations to drive improved latency and bandwidth reduction. Almost30% DRAM bandwidth/frame traffic reductionis expected,which translates to lower power, great for gaming workloads.
- These efficiency optimizations are possible with the new 5thgen GPU architecture-basedImmortalis-G720featuringdeferred vertex shading (DVS).
- Almost4x AI and ML performanceboost can be achieved as well by leveraging the new GPU.
Security and software advancements
- Arm continues to innovate onsecurityacrossfirmware,processandTEE.
- TheMemory Tagging Extension(MTE)capability increases memory safety from unsafe coded apps which normally comprise almost75% of Android vulnerabilities.
- Arm extends support for the Android Virtualization Framework (AVF) for secure execution of codes for 64-bit-based devices.
- Newer algorithms such as QARMA3 and enhancements for Pointer Authentication (PAC) and Branch Target Identification (BTI) reduce the overheads for maintaining security performance across the cluster.
- The9 million app developersArm enables continue to build applications for the64-bit architecture. For example, theChina ecosystemof app developers is100% compliant with 64-bit.
- Arm NN and Arm Compute Library offer optimization forML workloadson Armv9 architecture, which is being used by Google apps on Android with over100 millionactive users already.
生态系统路线图,traction and outlook
- Arm’s TCS24 will sport a Blackhawk premium core, Chaberton high-performance core, Hayes high-efficiency core and Krake GPU.
Source: Arm
- Arm’s overall ecosystem is the broadest and deepest considering its leading position in low-power architecture.
- Arm’s partnerships for TCS23 have mainly targeted Android-based computing devices and future Windows on Arm PCs
Source: Arm, Counterpoint Analysis
- Arm’s tighterGoogle(Android)partnershipis key to the development and success of TCS spanning from overallSoC-Android optimizationsto building robustsecurityfeatures toAI/ML optimizationsand more.
- MediaTekandTSMCremain the key fabless and fab partners for Arm and key drivers for TCS.
- MediaTek’sentry and growth in thepremium smartphone segmentisgreatnews forArmfrom the TCS adoption perspective.
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- MediaTek’sDimensity 9200/9200+was a great showcase forTCS22. The upcomingDimensity 9300is touted to sportfour Cortex-X4and four Cortex-A720 cores leveraging theTCS23platform.
- Arm has also seen great traction for TCS in theChinese ecosystem of OEMsandapp developersleveraging premium MediaTek solutions.
- Samsungis another great customer/partner for Arm. It continues tograpple with its overall Exynos SoCstrategy and performance and it remains to be seen how it leverages TCS23 or TCS24 for its future roadmap.
- Unlike TSMC, theSamsung LSIis not on top of the list of announcements as a key Arm partner for Cortex-X4 tapeouts on its 3nm nodes. This casts some shadow on the adoption of TCS23 bySamsungExynosorGoogleTensorin near-to- mid term.
- WhileQualcommandApplewill benefit from the new Armv9.2 cluster and system IP enhancements, they have tons of proprietary CPU customizations and in-house GPU designs and AI engines to completely leverage TCS23.
- This is one of the reasons why there has beenno direct endorsementfromQualcommorApplefor the new clusters or overall TCS23 at launch.
- Arm-based PCsis another area that has potential for growth mainly driven byApple,QualcommandMediaTek.
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- Thenext two yearsare going to besuper-crucial for Armas itpivots to a newer licensing model. Licensing opportunities for chipsets, especially in smartphones and PCs, have been shrinking with more vertical integration at its licensees, so the pivot makes sense but will have to wait and see.
Overall, theend-to-end system optimization provided by TCS23with enhancements across hardware and software unlocks performance and efficiencies to power future mobile computing experiences.Armremains alinchpinandTCS a foundational platformfor the industry to build onlow-power but high-performance computing experiences.
